30 years of Lexar: What a look inside its R&D labs and factory reveals about its plans for an AI-ready future

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Of course, Lexar cannot achieve all its plans without putting in the effort to develop new technologies. So, the company invited us to explore their various sites to see what it’s doing to achieve its goal of “Bridging Continents and Powering the World.”

One of the first places we visited was the Longsys Innovation Laboratory, located in the Foresee Building at Zhongshan. This is where Lexar’s parent company works on developing next-generation products, including DDR5 and LPDDR5/5X memory modules, PCIe 5.0 storage solutions, UFS4.1 memory cards, as well as CXL2.0/3.0 for data centers and AI systems. The lab covers an area of over 9,000 square feet and is staffed by over 50 personnel, of which 20 are full-time engineers, scientists, and researchers.

Everything begins at the Design Simulation & Signal Analysis Lab, where new Lexar products are developed, validated, and engineered. The Design Simulation Lab is where upcoming storage solutions are tested for thermal performance, structural rigidity, and signal and power integrity, while the Signal Analysis lab looks at the high-speed signals being sent throughout the entire system to ensure everything stays in spec and operates reliably.

Since Lexar relies on third-party suppliers for NAND and DRAM supplies, it must ensure the quality of the dies it receives and know exactly what’s inside each product it manufactures. This is where the Chip Resource Analysis Lab comes in, where multiple high-end machines test timings, memory redundancy, and the memory core, as well as running accelerated aging under stress (also known as burn-in testing), to ensure the quality and reliability of Lexar products over time.

Signal Analysis testing at the Lexar R&D lab (Image credit: Tom's Hardware) The Chip Resource Analysis lab (Image credit: Tom's Hardware) There are several labs that deal with completed products. There’s the System Verification Lab, where finished storage and memory items are tested for their power draw and timings, ensuring that Lexar DRAM meets JEDEC specifications. Lexar has a high-end gaming PC installed in the lab so that they can run their hardware on various benchmarking apps like AIDA64, 3DMark, and PCMark.

The Reliability Lab is where things are getting interesting, as Lexar puts its various products through their paces here. It has various testing machines, including the Drop Tester for simulating dropping an item from a height of up to 1.5 meters or 4 feet to a concrete or steel floor and the Roller Drop Tester, which continuously tumbles items between 5 to 25 RPM. There’s also the Plug-in/out Force Test machine, which simulates plugging in a memory card into a slot thousands of times and with various levels of force, the Tensile Test machine, which basically pulls on materials to see how much strength it takes to break them apart, and several other devices that check the durability of their prototypes and other products.

Aside from physical strength, the company also tests for electrostatic discharge resistance in its ESD lab, ensuring that its memory cards, storage drives, and memory modules aren’t killed by everyday static that people build up from their environment.

The tests we’ve mentioned above are mostly limited to day-to-day use. At the end of the hall sits the Environmental Lab, where Lexar puts its prototypes and products through the wringer. There are four testing machines here — the Salt Spray Test, which accelerates aging through a corrosive environment, the Precision High-Temperature Oven, where Lexar products are exposed to high temperatures while they are running, the Highly-Accelerated Stress Test, for reliability failure analysis, and the Dye Penetration Test, which looks at the effects of thermal shock on various components.

A Gaming PC in the Systems Verification Lab (Image credit: Tom's Hardware) The Push-Pull Force Tester at the Reliability Lab (Image credit: Tom's Hardware) The Highly-Accelerated Stress Test chamber in the Environmental Lab (Image credit: Tom's Hardware) Besides the ESD Lab, you’d find the X-ray Lab, where the tiny wiring and connections in the chip are analyzed. Inside it, you’ll find a combined 2D X-Ray and CT Scan machine, allowing Lexar engineers to find minute, microscopic defects. There’s also the Failure Analysis Lab, which looks at how the items fail after this series of tests, allowing Lexar to figure out what went wrong with them and rectify their shortcomings, ensuring that they do not fail once out in the real world.

Last, but not least, we visited the Materials Analysis Labs, where the scientists and engineers visually inspect the chips. Note that they do not just place them under a microscope — instead, this is an involved process where they would put the memory or storage module they want to inspect in resin and then use a precision cutter machine to exactly slice the material and reveal the area where the suspected damage is.

An engineer at work in the Failure Analysis lab (Image credit: Tom's Hardware) Inspecting wire traces in the Materials Analysis lab (Image credit: Tom's Hardware) A cross-sectioned chip ready for inspection (Image credit: Tom's Hardware) Now, all the testing here is done directly on the Lexar products and prototypes. However, storage and memory do not exist in a vacuum — instead, they must work with a massive number of different devices, like cameras, drones, security cameras, gaming handheld devices, desktops, laptops, tablets, dashcams, and so much more. So, our next stop was the Longsys Quality Labs.

Lexar has an extensive portfolio of memory and storage products, including CFexpress cards, SD cards, microSD cards, the NM card for some Huawei phones, portable SSDs, USB flash drives, M.2 and SATA SSDs, DDR4 and DDR5 memory modules, card readers, enclosures, and more. If Lexar plans to release any new product, it must ensure that it will work across a wide range of devices already on the market. Because of this, Longsys Quality Labs keeps more than 1,200 different gadgets across 35 categories to ensure that it can test its products before release.

For example, we saw more than 30 handheld gaming consoles on one desk, featuring popular brands and models like the Steam Deck, ROG Ally X, Lenovo Legion Go, and the Nintendo Switch 2, as well as from more niche brands like OneX Player, Ambernic, and more. There are also several drones and action cameras from DJI, as well as shelves of DSLRs, mirrorless, and point-and-shoot cameras from Canon, Nikon, Sony , and Fujifilm. The Lexar team also had multiple phones, including those from Chinese brands like Huawei, Xiaomi, Vivo, and Oppo, as well as popular international brands such as iPhone and Samsung. Aside from these flash devices, other rooms also stored a ton of more mundane gadgets, like dashcams, security cameras, and even automotive modules.

(Image credit: Tom's Hardware) (Image credit: Tom's Hardware) (Image credit: Tom's Hardware) (Image credit: Tom's Hardware) (Image credit: Tom's Hardware) After exploring the lab, we visited the Memory History Museum, where Lexar showed how storage technologies developed from prehistoric knots to the SSDs that we know today. We ended our day there, as our next stop would be the company’s manufacturing base in Suzhou, a two-hour flight from Shenzhen, which we took the following day.

Our entire group landed in Shanghai, and we took a one-and-a-half-hour drive to the Longforce Technology (Suzhou) Co., Ltd., which is the company’s manufacturing arm. We then made our way to the company’s production line for automotive storage, where we saw how NAND silicon wafers are turned into automotive-grade storage solutions. Since this is a silicon production line, we all had to wear cleanroom suits and get blasted with air jets before entering the actual production area. That way, we minimize the chances of bringing in contaminants that would affect yield rates.

(Image credit: Tom's Hardware) (Image credit: Tom's Hardware) The NAND arrives from the suppliers in wafer form, where it must first undergo taping, which is the mounting of the wafer to a backing material to ensure its rigidity during processing. That’s because a silicon wafer is extremely thin, and the backing material will protect it from cracking. From here, the wafer first undergoes pre-grinding, which thins out the wafer and makes it ready for cutting. It’s then cut into pieces with a laser using a technique called stealth dicing, because the cuts were made under the surface. From there, the wafer is finally fully ground to bring the wafer to its final thickness.

Once all of that is completed, the wafer is then finally mounted, and the tape is removed through DDS. It then goes through various processes until the die is mounted onto a substrate. From there, it will go through wire bonding, which connects all the layers of the die to the substrate, and be packaged via a C-Mold process. From there, it receives branding, and solder balls are attached to the underside of the substrate to make it ready for attachment to a PCB.

(Image credit: Lexar) (Image credit: Lexar) (Image credit: Lexar) Note that the process does not end there, as the chips are all built together into a single molded panel. They must first be cut into individual pieces through singulation. Once that is done, they go through final testing and quality control, and then the chips are packaged for delivery to clients.

Let's move to the executive Q and A on the following page.

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