While EMIB can support co-packaged IVR components, as this will not be a true embedded IVR, it will not be enough for a 5 kW – 6 kW AI accelerator. Of course, Intel has Foveros technologies (including Foveros Omni, Foveros Direct 3D, etc.), but these are not direct alternatives to CoWoS-L. While Intel's Foveros technology can certainly support multi-kilowatt power delivery with low IR drop, it does so by vertically stacking dedicated power tiles with logic, which provides extremely fast regulation and fine-grained control. However, this approach prioritizes low inductance and transient response over embedded passive volume, and therefore represents a fundamentally different IVR philosophy rather than a direct analogue to CoWoS-L. To that end, if Nvidia would like to use Foveros Direct3D packaging for Feynman, it would have to redesign the GPU compared to one produced by TSMC for CoWoS-L.
Given complexities with using EMIB and Foveros for high-end data center Feynman GPUs, it is more likely that Nvidia will wait before TSMC brings its advanced packaging to America towards the end of the decade, as it is hardly viable to redesign these large GPUs for Foveros. Still, Intel could probably land packaging orders for Vera CPUs or introduce its custom Xeon CPUs for Nvidia sooner rather than later to land some business from the company it got $5 billion of investment from recently.
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Anton Shilov is a contributing writer at Tom\u2019s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends. ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-13/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Anton Shilov Social Links Navigation Contributing Writer Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.
Pierce2623 I’m guessing Apple’s 3nm products will be fine on 18a. However, I doubt products built around TSMC 2n will be able to meet efficiency requirements considering the TSMC 3n iGPU is the only spot where Intel really made a splash on efficiency with Panther Lake. The 18a bits don’t really seem to offer any performance or even efficiency over the TSMC 3n chips already out there for the last year or so. Reply
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