HPE adopts AMD’s Helios rack architecture for 2026 AI systems — new rack form factor gets its first major partner ahead of 2026 availability

HPE adopts AMD’s Helios rack architecture for 2026 AI systems — new rack form factor gets its first major partner ahead of 2026 availability

New collaboration brings Open Rack Wide and first Venice-MI430X powered supercomputer into view.

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(Image credit: AMD) AMD and HPE are expanding their long-running partnership with a new agreement that will bring the AMD Helios rack-scale AI architecture into HPE’s product portfolio from 2026 onward. This will give Helios its first major OEM backer and position HPE to ship complete 72-GPU AI racks built around next-generation Instinct MI455X accelerators, new EPYC “Venice” CPUs, and an Ethernet-based scale-up fabric developed with Broadcom.

Helios has been AMD’s reference design for an open rack-level AI platform since its introduction earlier this year. It uses Meta’s Open Rack Wide mechanical standard and combines MI450-series GPUs, Venice CPUs, and Pensando networking hardware inside a liquid-cooled, double-wide chassis.

AMD has targeted up to 2.9 exaFLOPS of FP4 compute per rack with the MI455X generation , along with 31TB of HBM4 and a scale-up topology that exposes every GPU as part of a single pod. HPE will implement that design with a purpose-built HPE Juniper switch that supports Ultra Accelerator Link over Ethernet. The switch is the result of a collaboration with Broadcom and forms the backbone of the system’s high-bandwidth GPU interconnect.

Micron teams up with TSMC to deliver HBM4E, targeted for 2027

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