Micron's Environmental Impact Statement (EIS) filing, published in November 2025, indicates that Fab 1 site preparation was set to start in late 2025, but was obviously delayed by several weeks. The construction of the first facility is now set to begin in late 2026, and will run through Q2 2028. Given that equipping a fab typically takes nine to 24 months (depending on how you count), Micron expects the fab to start operations as early as Q1 2029. However, it will still take some time before the fab is fully equipped and ramped, so expect tangible DRAM output from Micron's New York Fab 1 by 2030, around five years later than originally planned.
The same documents schedule Fab 2 to break ground in the second half of 2028, Fab 3 in the second half of 2033, and Fab 4 in the first half of 2039. As a result, Micron's fab site near Clay, New York, will reach its full build-out and volume production by 2045, again, roughly five years behind the original timeline.
Micron's new campus in New York will manufacture DRAM using advanced process technologies and is ultimately planned to feature four fabs with four cleanrooms of 600,000 square feet (55,700 m²) each, constructed in four major build-out phases.
To put the 600,000 square feet number into context, GlobalFoundries Fab 8, located in Malta, New York, has a cleanroom space of approximately 460,000 square feet (though this is set to expand). The initial fab will cost around $20 billion, with successors expected to cost more, as Micron adopts more Low-NA EUV tools (priced around $235 million per unit) and eventually High-NA EUV tools (circa $400 million per unit) for its process technologies.
The New York complex will complement Micron's new site near Boise, Idaho. Last year, construction of the first new fab in Idaho (ID1) was completed, and the facility is now projected to begin wafer output in the second half of 2027 . The company is also hard at work in its efforts to speed up the completion of its fab ID2, which will be built adjacent to ID1, benefiting from shared infrastructure and R&D co-location. It is projected that ID2 will start mass production of DRAM ahead of New York's Fab 1, though no further details are known.
Micron's wafer fabrication facilities near Boise, Idaho, will be adjacent to the company's R&D center, so will adopt the latest process technologies and will benefit from short feedback loops between the fab's process-integration teams and R&D personnel nearby. Such close collaboration will likely enable faster time-to-yield, which will improve Micron's profitability.
The close collaboration between process-integration and R&D teams will be particularly instrumental given Micron's current focus on high-capacity enterprise -grade DDR5 for servers and high-bandwidth memory (HBM) for AI accelerators. Both types of products tend to consume large DRAM dies, so rapid yield improvement is particularly important for these kinds of applications, as larger DRAM dies are expensive to make.
Micron plans $9.6 billion HBM fab in Japan as AI memory race accelerates
Key considerations
- Investor positioning can change fast
- Volatility remains possible near catalysts
- Macro rates and liquidity can dominate flows
Reference reading
- https://www.tomshardware.com/pc-components/dram/SPONSORED_LINK_URL
- https://www.tomshardware.com/pc-components/dram/micron-to-begin-work-on-usd100-billion-new-york-megafab-imminently-landmark-site-to-produce-40-percent-of-companys-overall-dram-output-in-the-u-s-by-the-2040s#main
- https://www.tomshardware.com
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Informational only. No financial advice. Do your own research.