Rapidus explores panel-level packaging on glass substrates for next-generation processors
The company plans to operate a pilot back-end line this spring, mounting chips onto electronic substrates as part of its broader chiplet strategy. Pairing both 2nm logic and advanced packaging under one roof would give the company a way to distinguish itself from pure-play front-end fabs by shortening design-to-delivery cycles and reducing handoff friction between fab and assembly.
But integration alone doesn’t solve the bigger challenge of process control. At 2nm, it becomes computationally intensive in its own right, particularly in EUV lithography and defect inspection. In an interview with Nikkei , Tim Costa, Nvidia’s general manager of industrial and computational engineering, described how GPU acceleration has expanded across semiconductor manufacturing workflows.
“In the semiconductor field, applications in lithography processes that form circuits have progressed,” Costa said. He noted that Nvidia’s libraries can accelerate lithography computation by up to 70 times, and that at TSMC, design simulation calculations have been accelerated by a factor of 100. He also confirmed that Nvidia is already collaborating with Rapidus, for whom access to accelerated computational lithography andinspection will be mission-critical for ramping its 2nm production on schedule.
Rapidus’ roadmap cannot be separated from Japan’s broader industrial strategy. After decades of declining domestic lodge manufacturing share, Japan is attempting to re-establish itself at the leading edge. Backing from the Ministry of Economy, Trade and Industry provides financial support, but it doesn’t guarantee customers.
As a contract manufacturer, Rapidus must secure stable orders to maintain utilization rates. At 25,000 wafers per month, underutilization would quickly erode capital, so whether the company can demonstrate stable, early yields will influence whether fabless companies are willing to dual-source or shift designs onto its 2nm platform completely.
Rapidus is working with tight timelines, with 2027 mass production targets placing the company into direct competition with established 2nm roadmaps from the likes of TSMC and Samsung, while Intel is simultaneously vying for the same advanced logic designs with 18A .
With plans to expand capacity fourfold within its first year, Rapidus is clearly confident that it’ll be able to compete, but it’s a risky play. Such a large expansion magnifies execution risk dramatically and requires not only the right tooling but trained staff and stable supply chains for speciality materials. In other words, all the stars will need to align for Rapidus to pull this off without a hitch — and it remains to be seen whether they do.
Luke James is a freelance writer and journalist.\u00a0 Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.\u00a0 ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-13/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Luke James Social Links Navigation Contributor Luke James is a freelance writer and journalist. Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.
Key considerations
- Investor positioning can change fast
- Volatility remains possible near catalysts
- Macro rates and liquidity can dominate flows
Reference reading
- https://www.tomshardware.com/tech-industry/semiconductors/SPONSORED_LINK_URL
- https://www.tomshardware.com/tech-industry/semiconductors/rapidus-targets-2nm-mass-production-in-2027-with-a-four-times-capacity-ramp#main
- https://www.tomshardware.com
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