There's a lot of potential with both of these vapor chamber products, but Xerendipity is a relatively unknown newcomer in an otherwise very saturated market. The company doesn't really have an online presence either, but both of these items do seem production-ready and not just prototypes. Perhaps we'll soon see a phone with the entire back lined with the NVMC, while the Vapor-Pad works to keep the SoC in check.
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Hassam Nasir is a die-hard hardware enthusiast with years of experience as a tech editor and writer, focusing on detailed CPU comparisons and general hardware news. When he\u2019s not working, you\u2019ll find him bending tubes for his ever-evolving custom water-loop gaming rig or benchmarking the latest CPUs and GPUs just for fun. ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-18/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Hassam Nasir Social Links Navigation Contributing Writer Hassam Nasir is a die-hard hardware enthusiast with years of experience as a tech editor and writer, focusing on detailed CPU comparisons and general hardware news. When he’s not working, you’ll find him bending tubes for his ever-evolving custom water-loop gaming rig or benchmarking the latest CPUs and GPUs just for fun.
watzupken The main question is, how much will it cost? Some ideas are great… on paper. But commercializing it is the problem. When the new product cost significantly more than what it is replacing, it basically negates any interest in it. Reply
Faiakes So this is not a consumer product but rather something for AMD and INTEL to consider. Reply
usertests Faiakes said: So this is not a consumer product but rather something for AMD and INTEL to consider. It's Mobile World Congress. The focus is on phones here. Still waiting on Frore AirJet and other exotic cooling solutions to catch on. Reply
hotaru251 also the durabiltiy is issue…too much pressure would possibly damage it if it has an air gap inside it. Reply
bit_user hotaru251 said: also the durabiltiy is issue…too much pressure would possibly damage it if it has an air gap inside it. Yeah, I really wonder about this. On the flip side, they said it's as easy to apply as standard thermal pads, but those are mushy and don't need to be measured as precisely. So, that sort of makes me wonder whether it might be tolerant of a bit of squishing and deformation. Like, maybe it has some sort of foamy core. Reply
Alpha_Lyrae There isn't enough surface area to reliably cool once CPU is heat soaked (vapor will not condense fast enough). Thermal performance will be worse at that point. AMD actually made a heatspreader with a built-in vapor chamber and found that very issue. This will be no different. Solder will at least provide stable thermal conductivity between die and IHS. You're better off remaining delidded and doing direct-die cooling than using a vapor chamber pad between die and IHS. Phones with properly engineered vapor chambers have to direct heat to the chassis, otherwise the same heat-soak scenario plays out. Reply
bit_user Alpha_Lyrae said: There isn't enough surface area to reliably cool once CPU is heat soaked (vapor will not condense fast enough). Well, many high-performance laptops, GPUs, and server CPUs utilize vapor chambers. Even some of the highest-performing heatsinks for desktop PCs have a vapor chamber in the base. https://www.tomshardware.com/pc-components/air-cooling/deepcool-assassin-vc-elite-review Alpha_Lyrae said: AMD actually made a heatspreader with a built-in vapor chamber and found that very issue. Maybe this new company has better materials or fabrication techniques than what AMD looked at? Alpha_Lyrae said: Solder will at least provide stable thermal conductivity between die and IHS. You're better off remaining delidded and doing direct-die cooling than using a vapor chamber pad between die and IHS. Considering this was developed primarily for phones, I think solder is a non-starter. It probably has durability issues, not to mention maintenance. Also, there's what the article said about RF. Reply
GalaxianXtal The pictures label the product as an NMVC. I'm guessing Non-Metallic Vapor Chamber, but the author of the article keeps writing NVMC. Maybe thinks it's a Non-Volatile Memory Chamber, or possibly a Near-Vapor Memory Cooler. 😂 Reply
hotaru251 bit_user said: . So, that sort of makes me wonder whether it might be tolerant of a bit of squishing and deformation. Like, maybe it has some sort of foamy core. even then CPU's get put under a ton of stress if not done properly as there was a time intel's cpu's were being bent because of how hard their socket held the cpu down yet it was not balanced so the entire chip was bent. Reply
bit_user hotaru251 said: even then CPU's get put under a ton of stress if not done properly as there was a time intel's cpu's were being bent because of how hard their socket held the cpu down yet it was not balanced so the entire chip was bent. I understand that, but this thing is for phones. It's not clear whether it'd be suitable for high-pressure mounting applications, like desktop CPUs. Reply
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Reference reading
- https://www.tomshardware.com/phones/SPONSORED_LINK_URL
- https://www.tomshardware.com/phones/thermal-pads-with-in-built-vapor-chambers-claim-50-to-80-times-better-thermal-conductivity-than-normal-thermal-pads-1-200-w-m-k-vapor-pad-from-xerendipity-designed-to-replace-traditional-tim-in-a-cpu#main
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