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Tower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028
The Arai fab has been dark since 2022. Tower expects it to be production-ready for 300mm silicon photonics by late 2027.
Florida man arrested after allegedly stealing $220,000 in crypto using malware hidden in Steam Games — 8,000 devices infected
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AGI AI828 SSD Review: A near-last resort for those on a budget
The use of the PMIC makes sense when we look at the alignment of the drive: the controller is in the center. Leaving enough space for four NAND flash packages is ideal for a budget drive, and having the controller in the…
Nvidia CEO Jensen Huang’s trademark leather jacket raises nearly $1 Million at charity auction — bidding makes $60,000 valuation look like pocket change
A new one costs around $9,000, but ‘The Jensen Jacket: Jensen Huang’s Tom Ford Leather Jacket’ sold for $960,000.
TSMC commits another $100 billion to Arizona for at least four more 2nm fabs — 2026 capex could hit $64 billion following another record quarterly earnings
Wei also said TSMC is planning 13 leading-edge and advanced packaging fabs in Taiwan over the next several years, heading off concerns that the U.S. buildout comes at Taiwan’s expense. Execution in Arizona still faces la…
Grab a DJI Osmo camera at some of lowest US prices ever
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China’s 2.8-trillion-parameter Kimi K3 beats Claude Fable 5 in Frontend Code Arena benchmark— Moonshot AI delivers largest open-weight AI model ever, as China w
heffeque Truth hurts sometimes. You’ll see hurt people lash out statements of disbelief when presented with proof. Clearly things are changing, but some people prefer to think that the US doesn’t have a serious contender…
TSMC commits another $100 billion to Arizona for at least four more 2nm fabs — 2026 capex could hit $64 billion following another record quarterly earnings
Wei also said TSMC is planning 13 leading-edge and advanced packaging fabs in Taiwan over the next several years, heading off concerns that the U.S. buildout comes at Taiwan’s expense. Execution in Arizona still faces la…
Intel’s EMIB packaging gains traction as chip designers look to skirt TSMC’s CoWoS constraints — Google’s reported decision for 9th-gen TPUs highlights Intel’s
TSMC says panel packaging won’t replace CoWoS anytime soon for the largest future AI processors
