JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates

The standard supports bump pitches greater than 90 µm and channel reaches up to 20 mm, which are two features that enable dropping the expensive interposer and using less-expensive organic substrate routing. However, get…

Chinese memory and storage firm expected to post more than 60,000% jump in profits due to exploding demand — Lexar owner Longsys forecasts nearly $1.5 billion p

bit_user So, if one year they barely broke even, turning a $1 profit, and the next year they made $1M of profit, their profits would’ve grown 1 Million Times!!! Even though maybe their revenues increased only slightly (o…

Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai

A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…

Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai

A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…