Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the process
The bigger Phase 1 change is moving the memory controller from the XPU to the custom HBM base die. Han estimated controllers account for 5 to 10% of an XPU’s area — space that, refilled with compute, could yield a 10–20%…









