A university prototype is a very long way from production-grade commercial software. EDA tools require years of development, extensive process design kit integration with foundries, and validation across thousands of tape-outs before chipmakers trust them. "No single company can independently find all the answers along the path of semiconductor evolution," He Tingbo, chairwoman of the Huawei Scientist Committee and president of the company's semiconductor business department, said at a media briefing on Monday.
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Luke James is a freelance writer and journalist.\u00a0 Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.\u00a0 ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-24/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Luke James Social Links Navigation Contributor Luke James is a freelance writer and journalist. Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.
urn66 The importance of this should not be underestimated. Beyond the obvious improvements of concurrent design on multiple layers and the related benefits designing IC and package in one stack (something conventional 2D EDA tools do ins sequential interactions) is the strategic importance of this is to liberate Chinese designers who have suffered US embargoes of high-level design tools under Biden and Trump. The fact that a full-stack package is released concurrently wth the Huawei announcement shows a level of cooperation that will be critical to the success of the method. So once again, thanks to Biden and Trump for Making China Great Again. Reply
A_XTX24G Hmm, sounds great but application matters, for most, a phone is a phone. Reply
Conor Stewart A_XTX24G said: Hmm, sounds great but application matters, for most, a phone is a phone. That is just the first application of it. Why would it be limited to phones? We will likely see more and more chips being built with it. Reply
A_XTX24G Conor Stewart said: That is just the first application of it. Why would it be limited to phones? We will likely see more and more chips being built with it. On the question, sure why not? On the rest, pure speculation with no grounded root. There are many examples of technically impressive chip technologies that never achieved widespread adoption because of: Cost Manufacturing complexity Yield issues Packaging challenges Software/ecosystem limitations Competition from alternative approaches Intel Optane / 3D XPoint Promised a revolutionary middle ground between DRAM and NAND flash. Technically impressive with low latency and high endurance. Never achieved broad adoption due to cost, ecosystem inertia, and limited use cases.Intel Itanium Intended to replace x86 in high-performance computing. Massive engineering effort and significant technical innovation. Ultimately failed because x86 evolved faster and software compatibility mattered more.Intel EMIB and Foveros (early years) Advanced packaging technologies that generated enormous excitement. Adoption has been much slower and more selective than initial marketing implied because of cost and manufacturing complexity.IBM Cell Processor Extremely powerful and innovative architecture used in the PlayStation 3. Programming complexity limited broader industry adoption. HBM for consumer GPUs Technically superior in several respects to GDDR memory. Appeared in products such as the Radeon R9 Fury X. Cost and packaging complexity restricted widespread deployment for years. Monolithic 3D IC research Researchers have been demonstrating various forms of vertical transistor stacking and 3D logic integration for decades. Many promising papers and prototypes exist. Commercial deployment has been far slower than the technical promise suggested. 3D chip designs themselves are not new. Technologies like 3D stacking have existed for years, yet adoption has been selective because the trade-offs are significant. Maybe this architecture becomes widely adopted, maybe it doesn't. Nothing in the article establishes that "we will likely see more and more chips built with it." Reply
Key considerations
- Investor positioning can change fast
- Volatility remains possible near catalysts
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Reference reading
- https://www.tomshardware.com/tech-industry/semiconductors/SPONSORED_LINK_URL
- https://www.tomshardware.com/tech-industry/semiconductors/peking-university-builds-3d-chip-design-tool-tailored-to-huaweis-logicfolding-architecture#main
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