Terafab’s procurement team reportedly has already been to Japan, asking some toolmakers to deliver within months.
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Samsung’s DRAM capacity was estimated last year at 650,000–700,000 wafers a month, while SK hynix is reportedly at about 550,000, with about 1 million a goal by 2030. The comparison has to be taken in context, as Terafab’s 700,000 measures all of its expected memory output, which could be NAND or DRAM, while the Samsung and SK hynix figures measure only DRAM. As it is, the memory portion alone would be 3.5 times the reported 200,000 at SK hynix’s Wuxi fab in China.
Many in the industry were skeptical when Musk announced the plans in March , but orders are now leading more companies to see a real business opportunity. The timeline is aggressive, as it usually takes three years or more to get from planning to volume at a leading-edge fab, and Terafab is targeting volume production in the second half of 2028. Procurement officials from the company reportedly visited Japan earlier this month to meet local suppliers and to work on details on bringing in equipment , with some suppliers asked to deliver within a few months.
The Elec also reports that Terafab representatives visited booths of about 10 Korean materials, parts, and equipment firms at SEMICON West, with some NDAs signed.
Logic chips are one thing — Jiji Press reports Terafab is working with Intel to adopt its 2nm and 1.4nm processes — but memory is another, and it’s not clear what type of memory is on the docket. Technical help from a Taiwanese company is under consideration for memory, but no partner has been named, leaving 70% of the planned wafers without a disclosed process technology.
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Key considerations
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Reference reading
- https://www.tomshardware.com/tech-industry/semiconductors/SPONSORED_LINK_URL
- https://www.tomshardware.com/tech-industry/semiconductors/elon-musks-terafab-targets-1-million-wafers-a-month-after-2032-planned-700-000-monthly-memory-wafers-could-rival-samsungs-entire-estimated-dram-production-capacity#main
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