When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works .
"When you look at the defect density, 14A is tracking better than the target curve we had for 14A," Zinsner said at Deutsche Bank's 2026 Technology Conference. "It is also doing better than any of the previous nodes in terms of how quickly we are bringing down the defects. In fact, we have not seen this performance since 22nm, which is arguably one of the best nodes Intel has ever put out."
Intel intends to begin risk production of its own products on 14A fabrication process in the second half of 2027 and then initiate its high-volume manufacturing in 2028, so 14A is two years away from mass production. So, what Intel's CFO said at the conference is that at this point in 14A's development, its defect reduction trajectory looks at least as healthy as the trajectory of the company's exceptionally successful 22nm process at a comparable point in its development (i.e., in 2010). There are a couple of catches with such phrasing, though. Firstly, the defect density on 14A now is not necessarily equivalent to a defect density on 22nm two years away from mass production. Secondly, due to advances of wafer processing and inspection equipment, what Intel counts as a defect now may not be the same thing as what it counted as a defect 16 years ago. Furthermore, defect density itself does not directly equal product yield.
Intel's 22nm was the company's first manufacturing process to rely on FinFET transistors and at the time was the most advanced process technology in the world; the rest of the industry moved to FinFET devices only with their 14nm and 16nm-class nodes in 2014 and 2015. By contrast, 14A will use second-generation gate-all-around (GAA) RibbonFET transistors, second-generation backside power delivery called PowerDirect, and will be able to use High-NA EUV lithography due to extremely complex patterning. Keeping all of that in mind, Intel's claim that 14A defect density reduction is progressing unusually well this far ahead of HVM is certainly good news.
Meanwhile, comparing 14A to 22nm's successors should be quite comforting for Intel as 14nm mass production was delayed by a year due to insufficient yield, the first-generation 10nm node was a failure, 20A was cancelled, 18A defect density was high even as it hit HVM milestone, while the company did not share almost any information about the progress of its Intel 4 and Intel 3 nodes.
Intel commits to 14A mass production in 2028 as its sales rise 25% year-over-year
Intel 18A wafer-to-wafer yield issues fixed, report claims
Key considerations
- Investor positioning can change fast
- Volatility remains possible near catalysts
- Macro rates and liquidity can dominate flows
Reference reading
- https://www.tomshardware.com/tech-industry/semiconductors/SPONSORED_LINK_URL
- https://www.tomshardware.com/tech-industry/semiconductors/intel-14a-defect-density-is-dropping-faster-than-the-company-expected-we-have-not-seen-this-performance-since-22nm-says-cfo#main
- https://www.tomshardware.com/membership
- Trump administration weighs expanding chip tariffs to laptops, consoles, and servers, report claims — January's data center exemptions may be scrapped
- SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029
- Many talks between data center developers and local governments are wrapped in secrecy behind non-disclosure agreements — residents question the need for NDAs,
- Microsoft Paint and Photos apps add invisible watermark to AI-generated content — developer reverse engineers GUID embedding
- GeForce NOW Shakes Up August With 26 New Games
Informational only. No financial advice. Do your own research.