Lenovo ThinkCentre X Ultra packs Gorgon Halo — AMD Ryzen AI Max+ Pro 495 shows up in mini workstation

Lenovo ThinkCentre X Ultra packs Gorgon Halo — AMD Ryzen AI Max+ Pro 495 shows up in mini workstation

emerth I like this kind of machine, also the machines made with the previous 300 series AI Pro CPUs. IDK that I would use it for AI, but as a compact dev machine certainly, only allocate most of the RAM to the CPU. I like a decent GPU in any desktop machine. However at this price I would very much like to have SO-DIMMs not soldered. Reply

usertests emerth said: However at this price I would very much like to have SO-DIMMs not soldered. AFAIK there have been no Strix Halo devices with socketed memory, even CAMM. Also, SO-DIMM is done after DDR5. So we have to ask ourselves if socketed memory is possible for future generations like Medusa Halo. The answer is NO so far. Medusa Halo could be using LPDDR6, possibly with a cheaper LPDDR5X option. If we aren't getting 256-bit LPCAMM for technical reasons now, are we getting it later? Maybe the Nvidia-designed SOCAMM(2/3) can make it happen, even though it's not consumer-oriented (all you need is volume). But stakeholders need to come together for us to have a chance of getting upgradeable memory with these big APUs. As long as soldered 192-256 GB is "cheap" post-crash, it doesn't matter that much. Max it out and move on. Except that soldered is going to be less repairable. Reply

emerth usertests said: AFAIK there have been no Strix Halo devices with socketed memory, even CAMM. Also, SO-DIMM is done after DDR5. So we have to ask ourselves if socketed memory is possible for future generations like Medusa Halo. The answer is NO so far. Medusa Halo could be using LPDDR6, possibly with a cheaper LPDDR5X option. If we aren't getting 256-bit LPCAMM for technical reasons now, are we getting it later? Maybe the Nvidia-designed SOCAMM(2/3) can make it happen, even though it's not consumer-oriented (all you need is volume). But stakeholders need to come together for us to have a chance of getting upgradeable memory with these big APUs. As long as soldered 192-256 GB is "cheap" post-crash, it doesn't matter that much. Max it out and move on. Except that soldered is going to be less repairable. I don't really mind what variety of socketed RAM it is as long as it is a standardized form. I just want to be able to upgrade or move memory around. SOCAMM is fine, I am sure you are right about SO-DIMM going forward. Reply

usertests emerth said: I don't really mind what variety of socketed RAM it is as long as it is a standardized form. I just want to be able to upgrade or move memory around. SOCAMM is fine, I am sure you are right about SO-DIMM going forward. Yeah, we're entering a very uncertain situation with multiple standards competing over a shrinking piece of the pie (because companies would rather give you soldered and upsell you for more memory). It seems like LPCAMM isn't doing well. Low volume and high prices (compounded by memory crisis) hurt adoption. SODIMM being dead after DDR5 is straight outta JEDEC. It is toast. Reply

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