Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

The iHBM concept embeds thermally conductive, electrically insulating blocks into the base die’s die-to-die PHY region, the interface hotspot where power density peaks, for a claimed thermal resistance reduction of more …

Cooler Master Q300L v3 MicroATX case review: Sub-$45 MSRP offers incredible value for MicroATX chassis with included fans

Last but certainly not least, the outside features the front IO panel on the bottom with your typical selection of ports. Starting on the left is a fast USB 3.2 Gen 2×2 (20 Gbps) Type-C port. Next are two USB 3.2 Gen 1 (…

Universitas Gadjah Mada, Indosat and NVIDIA Open Indonesia’s First University AI Center to Develop Local AI Talent

This week, the Ministry of Communication and Digital Affairs (Komdigi), Indosat Ooredoo Hutchison (Indosat or IOH), NVIDIA and Universitas Gadjah Mada (UGM) launched the UGM Indosat NVIDIA AI Technology Center (NVAITC) i…