Computex 2026 Day One Wrap-Up: Arm makes a bold play for Windows PCs, PCIe 6.0 SSDs are coming, Asus embraces black and gold for ROG 20th
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Metal 3D printed heatsinks on motherboards, more wood, infinity cooling extends down the RTX line, oh my.

Listed exhibitors say permits were left pending with no formal rejection, repeating an April freeze at Taipei AMPA.

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The shift to agentic AI creates a new CPU requirement for the AI factory: fast cores, massive memory bandwidth and the ability to sustain high performance when all cores are active.

Joe Shields is a staff writer at Tom\u2019s Hardware. He reviews motherboards and PC components. “,”collapsible”:{“enabled”:true,”maxHeight”:250,”readMoreText”:”Read more”,”readLessText”:”Read less”}}), “https://slice.va…

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You can read more about second-gen SoIC in our SoIC roadmap on Tom’s Hardware Premium , though it has far more implications for the data center (at least currently) than for consumer chips. Regardless, AMD couldn’t simpl…

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That has vastly lowered the barrier to entry with X3D CPUs, especially as Zen 3 options have dried up in the market. Prior to the Ryzen 5 7600X3D showing up online, you’d have to spend at least $350 (and likely more) to …
