SMIC’s third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advan
SemiAnalysis’ teardown indicates that SMIC’s N+3 fabrication process supports a minimum metal pitch of 32.5nm, which is nominally tighter than the approximately 36nm pitch used for many high-performance cells in Intel’s …
