$1 billion of iPhone 18 Pro chips ‘on the shelves awaiting packaging’ due to DRAM shortages — memory shortages reportedly put a wrinkle in Apple’s launch plans

$1 billion of iPhone 18 Pro chips 'on the shelves awaiting packaging' due to DRAM shortages — memory shortages reportedly put a wrinkle in Apple's launch plans

Jake Roach is the Senior CPU Analyst at Tom\u2019s Hardware, writing reviews, news, and features about the latest consumer and workstation processors. ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-25/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Jake Roach Social Links Navigation Senior Analyst, CPUs Jake Roach is the Senior CPU Analyst at Tom’s Hardware, writing reviews, news, and features about the latest consumer and workstation processors.

usertests Entry-level iPhone 18 is expected to move from 8 GB to 9 GB, providing the crucial memory upgrade Nvidiwon't. Reply

Alastor01 Apologies if stupid question, but I fail to understand why do DRAM shortages affect phones in the first place? Don't they use SoCs where memory is on the chip already among other components? Does that not use a different process of manufacturing? Reply

usertests Alastor01 said: Apologies if stupid question, but I fail to understand why do DRAM shortages affect phones in the first place? Don't they use SoCs where memory is on the chip already among other components? Does that not use a different process of manufacturing? There are AI products using the same LPDDR5X chips as phones, sometimes in a different form factor like SOCAMM. For example, Nvidia's Vera Rubin comes with up to 1.5 terabytes of LPDDR5X. Intel's Crescent Island AI PCIe card comes with 160 GB, possibly up to 480 GB of LPDDR5X. AMD's Strix Halo is surrounded with eight LPDDR5X chips, initially up to 128 GB, soon increasing to 192 GB for Gorgon Halo. Some (most?) phones are using package on package (PoP) memory, but it doesn't mean the memory is made on the same silicon (like most SRAM), and it doesn't affect the economics of the memory chips. They still have to be manufactured separately at memory fabs before the packaging step. Reply

Alastor01 usertests said: There are AI products using the same LPDDR5X chips as phones, sometimes in a different form factor like SOCAMM. For example, Nvidia's Vera Rubin comes with up to 1.5 terabytes of LPDDR5X. Intel's Crescent Island AI PCIe card comes with 160 GB, possibly up to 480 GB of LPDDR5X. AMD's Strix Halo is surrounded with eight LPDDR5X chips, initially up to 128 GB, soon increasing to 192 GB for Gorgon Halo. Some (most?) phones are using package on package (PoP) memory, but it doesn't mean the memory is made on the same silicon (like most SRAM), and it doesn't affect the economics of the memory chips. They still have to be manufactured separately at memory fabs before the packaging step. Thanks for explanation! Reply

kealii123 You don't hate ai companies enough. You think you do, but you don't. Reply

CrazyCarrot911 kealii123 said: You don't hate ai companies enough. You think you do, but you don't. There's this new Ai o_O It tells your wife to shut up when she's wrong…. The end of all Ai Reply

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