Intel's fab roadmap examined — Arizona, Ohio, Ireland, and the two deadlines deciding 14A process node
This ultimately means that leading-edge logic wafers are now being fabbed in the U.S. by two companies on two competing nodes. That’s a genuine change and, by any measure, a monolithic achievement when compared to the start of the decade, and neither company overstates that in their corporate blogs.
However, a Blackwell data center GPU pairs two reticle-sized compute dies with eight stacks of HBM3e on a silicon interposer using TSMC's CoWoS-L packaging, and all of TSMC's CoWoS capacity is located in Taiwan. TSMC’s U.S. facilities currently send 100% of their chips to Taiwan for packaging, including wafers fabbed in Phoenix. A Blackwell die fabbed in Arizona therefore travels roughly 7,000 miles to be diced, stacked, and mounted, then travels onward through system assembly before any of it returns to a U.S. data center.
As for HBM, every stack in production today comes out of SK hynix and Samsung facilities in South Korea or Micron's fabs in Taiwan and Japan, and the ABF substrates beneath the interposer are similarly concentrated in Japan and Taiwan. No U.S. facility currently manufactures or packages HBM. The one company running advanced packaging at scale on U.S. soil is Intel, whose Foveros operation in New Mexico handles its own 3D-stacked products and has started attracting outside interest ; Google has reportedly booked Intel to package more than 3 million TPUs in 2028. Intel doesn’t currently appear anywhere in Nvidia's list of manufacturing partners.
Amkor also broke ground on its Peoria, Arizona campus last October, a $7 billion, two-phase project with up to 750,000 square feet of cleanroom, roughly $400 million in CHIPS Act funding, and Apple and Nvidia signed as lead customers. Its first factory will be completed in mid-2027, with production beginning in early 2028. TSMC formalized the relationship on June 16th, signing a 10-year agreement under which it will procure packaging and test services from Amkor, while TSMC executives said in April that the foundry's own Arizona packaging facility will bring CoWoS and 3D-IC capacity online before 2029.
SK hynix began initial work in April on its $3.87 billion advanced packaging plant in West Lafayette, Indiana, targeting mass production of HBM4E and HBM5 in the second half of 2028, the same window Amkor’s aiming for. The timing means the entire Blackwell family, and likely the first Rubin generation, will complete their product lifecycles without a fully domestic manufacturing path. The first AI accelerators that can be fabbed, packaged, and fitted with U.S.-packaged memory without leaving the country will be HBM4E-era parts arriving around 2028 to 2029.
Unfortunately, the Section 48D advanced manufacturing tax credit, raised to 35% last July, doesn’t apply to projects whose construction begins after December 31st, 2026, which gives Coherent's June groundbreaking, SK hynix's April piling work, and Amkor's October start a shared fiscal deadline if they want to benefit from it.
As for Foxconn and Wistron’s Houston and Fort Worth plants, they’ll receive GPUs packaged in Taiwan and assemble them into trays, racks, and systems on U.S. soil. It’s that type of assembly work that’s carrying most of the $500 billion figure, which counts the value of AI infrastructure produced rather than capital spent on factories. Wafers are American, racks are American, but everything in between isn’t. Whether that changes on schedule is a question for 2028, and it depends highly on two packaging campuses in Arizona and one in Indiana meeting their deadlines.
Luke James is a freelance writer and journalist.\u00a0 Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.\u00a0 ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-25/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Luke James Social Links Navigation Contributor Luke James is a freelance writer and journalist. Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.
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- https://www.tomshardware.com/tech-industry/nvidia-and-intel-tout-chips-built-in-america-but-every-arizona-made-blackwell-die-is-still-packaged-in-taiwan#main
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