Both memory leaders now target the same die-to-die hotspot with rival in-package cooling designs.
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Rather than letting heat escape outward through the core dies, HPB builds a separate set of thermal pillars that pull heat from inside the stack and carry it to a spreader sitting above or beside the package, according to Samsung at Computex .
The design concentrates on the D2D PHY layer, the high-speed link between the HBM base die and the GPU, where power density and temperatures increase exponentially as stacks grow taller and run quicker. Samsung said it has already implemented and verified HPB on HBM4E, the generation whose first 12-layer samples it began shipping last month at 14 Gbps, scaling to 16 Gbps, with 3.6 TB/s of bandwidth per stack.
Samsung runs both a memory business and a logic foundry, letting it build the HBM5 stack and the 2nm die beneath it in-house. "AI systems are becoming more powerful and densely integrated, making heat management, data-processing efficiency, and packaging stability just as important as memory performance itself," Song Jai-hyuk, president and CTO of Samsung's Device Solutions division, told reporters at Computex, according to the Korea Herald . Song said the company would keep building its competitiveness in next-generation memory through cooperation with partners, including Nvidia.
Last year, a roadmap from KAIST projected HBM5 reaching a 4,096-bit interface, roughly 4 TB/s per stack, and about 100 watts of per-stack power, a thermal load that goes a long way in explaining why both Korean memory giants are reworking their packaging now rather than at launch.
SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source
Key considerations
- Investor positioning can change fast
- Volatility remains possible near catalysts
- Macro rates and liquidity can dominate flows
Reference reading
- https://www.tomshardware.com/tech-industry/semiconductors/SPONSORED_LINK_URL
- https://www.tomshardware.com/tech-industry/semiconductors/samsung-shows-first-hbm5-mockup-at-computex-with-heat-path-block-cooling#main
- https://www.tomshardware.com/subscription
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