China’s CXMT targets 30% DRAM memory market share by 2030 with sixth mega-fab — future plans bottlenecked by access to advanced chipmaking tools
Three major PC makers now using Chinese memory to fight ‘unprecedented memory shortage,’ report claims
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DRAM chip supply to module makers could drop by more than 70% year-on-year in 2027, says Apacer CEO — demand for HBM and server RAM continues to devour manufact
NAND flash is also being pulled into the AI boom. High-capacity enterprise SSDs are increasingly being used for model storage, data staging and key-value cache offloading, allowing colder portions of AI workloads to spil…
DRAM chip supply to module makers could drop by more than 70% year-on-year in 2027, says Apacer CEO — demand for HBM and server RAM continues to devour manufact
NAND flash is also being pulled into the AI boom. High-capacity enterprise SSDs are increasingly being used for model storage, data staging and key-value cache offloading, allowing colder portions of AI workloads to spil…
CXMT close to matching Micron’s memory capacity in 2026, research claims — would put China on track to become world’s second-largest DRAM producer
Still, both SMEE and SiCarrier will need time to ramp up production of their lithography systems, whereas DRAM makers must learn how to use them efficiently, so we would not be as optimistic as the authors and would not …
CXMT close to matching Micron’s memory capacity in 2026, research claims — would put China on track to become world’s second-largest DRAM producer
Still, both SMEE and SiCarrier will need time to ramp up production of their lithography systems, whereas DRAM makers must learn how to use them efficiently, so we would not be as optimistic as the authors and would not …
JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates
The standard supports bump pitches greater than 90 µm and channel reaches up to 20 mm, which are two features that enable dropping the expensive interposer and using less-expensive organic substrate routing. However, get…
JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates
The standard supports bump pitches greater than 90 µm and channel reaches up to 20 mm, which are two features that enable dropping the expensive interposer and using less-expensive organic substrate routing. However, get…
Memory price surge begins to cool as consumers hit affordability limit — AI demand still keeps DRAM and NAND prices climbing through Q3 2026
For PC builders, the report suggests that meaningful price relief is still some way off. Memory prices are continuing to rise because AI infrastructure remains the industry’s top priority. However, the pace of those incr…
Memory price surge begins to cool as consumers hit affordability limit — AI demand still keeps DRAM and NAND prices climbing through Q3 2026
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Inside the history of DRAM price-fixing lawsuits — how HBM allocations could make a difference after two decades of failed cases
In the 2018 case, the plaintiffs offered eight plus factors, including trade-press statements about supply discipline and attendance at the same industry events, and both courts found them consistent with each company in…