hbm

JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates

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The standard supports bump pitches greater than 90 µm and channel reaches up to 20 mm, which are two features that enable dropping the expensive interposer and using less-expensive organic substrate routing. However, get…

Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai

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A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…

Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai

by

A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…

JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates

by

The standard supports bump pitches greater than 90 µm and channel reaches up to 20 mm, which are two features that enable dropping the expensive interposer and using less-expensive organic substrate routing. However, get…

Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai

by

A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…

Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai

by

A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…

Inside the history of DRAM price-fixing lawsuits — how HBM allocations could make a difference after two decades of failed cases

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In the 2018 case, the plaintiffs offered eight plus factors, including trade-press statements about supply discipline and attendance at the same industry events, and both courts found them consistent with each company in…