SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029

SK hynix’s HBM production site in West Lafayette, Indiana, will specialize in advanced packaging, testing, and R&D of HBM. The facility is set to cost the company around $4 billion, which highlights its advanced technolo…

Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited — new memory format strikes a balance betwe

Additionally, more local capacity could also reduce communication between accelerators. Conventional expert parallelism distributes experts across GPUs and requires all-to-all communication at every layer. OXMIQ claims t…

Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is ‘gettin

Micron’s presentation put compute performance scaling at roughly three times every two years and HBM bandwidth at under two times, a divergence Sreeramaneni summarized by saying “the memory wall is still present, and, in…

Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is ‘gettin

Micron’s presentation put compute performance scaling at roughly three times every two years and HBM bandwidth at under two times, a divergence Sreeramaneni summarized by saying “the memory wall is still present, and, in…

Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited — new memory format strikes a balance betwe

Additionally, more local capacity could also reduce communication between accelerators. Conventional expert parallelism distributes experts across GPUs and requires all-to-all communication at every layer. OXMIQ claims t…

Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is ‘gettin

Micron’s presentation put compute performance scaling at roughly three times every two years and HBM bandwidth at under two times, a divergence Sreeramaneni summarized by saying “the memory wall is still present, and, in…

Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

The iHBM concept embeds thermally conductive, electrically insulating blocks into the base die’s die-to-die PHY region, the interface hotspot where power density peaks, for a claimed thermal resistance reduction of more …

Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is ‘gettin

Micron’s presentation put compute performance scaling at roughly three times every two years and HBM bandwidth at under two times, a divergence Sreeramaneni summarized by saying “the memory wall is still present, and, in…

Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is ‘gettin

Micron’s presentation put compute performance scaling at roughly three times every two years and HBM bandwidth at under two times, a divergence Sreeramaneni summarized by saying “the memory wall is still present, and, in…