Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRA

Mounting the wafer-scale engines vertically in the backpack modules lets Cerebras do away with a PCB or substrate for the wafer to handle all its supporting infrastructure. Instead, the backpack connects the large copper…

Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach — tech allows for more compute from fixed data center power budgets

At the rack level, DSX MaxLPS offers further flexibility through workload-specific power profiles. Much like the quiet, balanced, and high-performance power modes that client PC users are familiar with, Nvidia has produc…

Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRA

Mounting the wafer-scale engines vertically in the backpack modules lets Cerebras do away with a PCB or substrate for the wafer to handle all its supporting infrastructure. Instead, the backpack connects the large copper…

Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRA

Mounting the wafer-scale engines vertically in the backpack modules lets Cerebras do away with a PCB or substrate for the wafer to handle all its supporting infrastructure. Instead, the backpack connects the large copper…

Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark — LP30-based rack already in production, company s

A Rubin GPU carries 288GB of HBM4 , roughly 576 times the memory of a single LP30, so a 31-billion-parameter model at FP8 needs on the order of 62 LPUs to hold its weights, and a large mixture-of-experts model runs into …