Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark — LP30-based rack already in production, company s

A Rubin GPU carries 288GB of HBM4 , roughly 576 times the memory of a single LP30, so a 31-billion-parameter model at FP8 needs on the order of 62 LPUs to hold its weights, and a large mixture-of-experts model runs into …

Hot Chips 2026: OpenAI’s Jalapeño AI ASIC unpacked — accelerator developed using AI achieves efficiency and throughput gains against power-hungry Blackwell

To explain how it works, let us compare OpenAI’s and Nvidia’s approaches. Nvidia’s standard system-level decomposition is primarily two phases: prefill and decode. Prefill is generally compute-bound (which is why Nvidia …

Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller

The important point is that CMN-S3 is not just an internal CPU mesh, as Arm designed the coherent system to extend outside of the die to extend coherency beyond the die and the socket. The approach is conceptually closer…

Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited — new memory format strikes a balance betwe

Additionally, more local capacity could also reduce communication between accelerators. Conventional expert parallelism distributes experts across GPUs and requires all-to-all communication at every layer. OXMIQ claims t…

Hot Chips 2026: OpenAI’s Jalapeño AI ASIC unpacked — accelerator developed using AI achieves efficiency and throughput gains against power-hungry Blackwell

To explain how it works, let us compare OpenAI’s and Nvidia’s approaches. Nvidia’s standard system-level decomposition is primarily two phases: prefill and decode. Prefill is generally compute-bound (which is why Nvidia …

Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRA

Mounting the wafer-scale engines vertically in the backpack modules lets Cerebras do away with a PCB or substrate for the wafer to handle all its supporting infrastructure. Instead, the backpack connects the large copper…

Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark — LP30-based rack already in production, company s

A Rubin GPU carries 288GB of HBM4 , roughly 576 times the memory of a single LP30, so a 31-billion-parameter model at FP8 needs on the order of 62 LPUs to hold its weights, and a large mixture-of-experts model runs into …