Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth

A PIMX_RD reads the weight data from the DRAM bank, feeding into the MAC trees alongside the data from the SRF. Once the calculation is done, the output vector from each operation is written into the Vector Register File…

Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach — tech allows for more compute from fixed data center power budgets

For modern rack-scale systems like Nvidia’s NVL72s, that’s an entire rack and change that could safely be installed within the same power budget, and indeed, that’s just what the company’s example shows. And across those…

Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach — tech allows for more compute from fixed data center power budgets

For modern rack-scale systems like Nvidia’s NVL72s, that’s an entire rack and change that could safely be installed within the same power budget, and indeed, that’s just what the company’s example shows. And across those…

Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth

A PIMX_RD reads the weight data from the DRAM bank, feeding into the MAC trees alongside the data from the SRF. Once the calculation is done, the output vector from each operation is written into the Vector Register File…

Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is ‘gettin

Micron’s presentation put compute performance scaling at roughly three times every two years and HBM bandwidth at under two times, a divergence Sreeramaneni summarized by saying “the memory wall is still present, and, in…

Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

The iHBM concept embeds thermally conductive, electrically insulating blocks into the base die’s die-to-die PHY region, the interface hotspot where power density peaks, for a claimed thermal resistance reduction of more …

Cooler Master Q300L v3 MicroATX case review: Sub-$45 MSRP offers incredible value for MicroATX chassis with included fans

Last but certainly not least, the outside features the front IO panel on the bottom with your typical selection of ports. Starting on the left is a fast USB 3.2 Gen 2×2 (20 Gbps) Type-C port. Next are two USB 3.2 Gen 1 (…

Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth

A PIMX_RD reads the weight data from the DRAM bank, feeding into the MAC trees alongside the data from the SRF. Once the calculation is done, the output vector from each operation is written into the Vector Register File…