Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant
The financing and a 10-year supply deal meet the conditions GlobalWafers’ CEO publicly set for expanding in Sherman, Texas.
intel
Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers
Japan’s national champion has EUV running and a 2nm GAA prototype, but still lacks a single committed volume customer.
Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers
Japan’s national champion has EUV running and a 2nm GAA prototype, but still lacks a single committed volume customer.
Intel preps 28-core Nova Lake-S CPUs for Dunlow workstation platform — Entry-level Xeon chip features LGA1954 socket
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Intel preps 28-core Nova Lake-S CPUs for Dunlow workstation platform — Entry-level Xeon chip features LGA1954 socket
Follow Tom’s Hardware on Google News , or add us as a preferred source , to get our latest news, analysis, & reviews in your feeds.
Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers
Japan’s national champion has EUV running and a 2nm GAA prototype, but still lacks a single committed volume customer.
Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers
Japan’s national champion has EUV running and a 2nm GAA prototype, but still lacks a single committed volume customer.
Intel preps 28-core Nova Lake-S CPUs for Dunlow workstation platform — Entry-level Xeon chip features LGA1954 socket
Follow Tom’s Hardware on Google News , or add us as a preferred source , to get our latest news, analysis, & reviews in your feeds.
Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repai
A large portion of the patent application focuses not on the memory cell at all but on how to mount it. Intel details memory-on-package (MoP) and “reversed overhang” structures aimed at cutting the stack’s Z-height — con…
Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers
Japan’s national champion has EUV running and a 2nm GAA prototype, but still lacks a single committed volume customer.