Kioxia and Sandisk demonstrate the world’s highest-density 3D NAND flash — 332 active layers and up to 4,800 MT/s interface

Kioxia and Sandisk demonstrate the world's highest-density 3D NAND flash — 332 active layers and up to 4,800 MT/s interface

The new BiCS10 3D QLC NAND flash IC with record storage density is aimed at data center-grade SSDs that must offer both high-capacity and decent performance enabled by high-speed I/O of flash memory. Since such applications also strive to reduce power consumption, Kioxia and Sandisk also implemented their power-isolated low-tapped termination (PI-LTT) technique designed to reduce the power consumed by high-speed output drivers without sacrificing signal integrity.

Since Kioxia and Sandisk produce their BiCS10 3D QLC NAND device using their latest BiCS10 process technology, they not only achieve the record bit density, but also lower costs compared to competing high-density 3D QLC NAND ICs once their yields reach target levels. As a result, the two companies will be able to offer ultra-high-capacity SSDs at prices that are lower compared to those of rivals, or get higher margins while selling at similar prices.

"By redefining the performance and efficiency envelope of QLC NAND, our 10 th Generation BiCS QLC 3D flash memory delivers simultaneous gains in density, bandwidth, and energy efficiency and establishes a new paradigm for high‑capacity flash storage to provide a scalable foundation for next‑generation infrastructure applications," said Alper Ilkbahar, chief technology officer at Sandisk.

Kioxia and Sandisk sample world's densest 3D NAND

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