For chipmakers, the main challenge with ASML's High-NA EUV tools are substantially higher costs compared to Low-NA EUV systems used today, which greatly increases costs of fabs and can affect costs of chips. Meanwhile, High-NA EUV scanners introduce a smaller exposure field, which can require die stitching for large chips and complicate designs, which largely diminish their performance advantage over regular Low-NA EUV systems that stems on reducing the need for using multipatterning.
In addition, High-NA EUV needs improved photoresists, different masks, pellicles, metrology, inspection, and computational lithography, just to name some of the requirements. As a result, chipmakers must determine when it makes sense for them to use expensive single-patterning on High-NA EUV tools and when they can live with increasingly mature 0.33-NA EUV multi-patterning. For example, Intel intends use High-NA EUV tools with some of its 14A technologies, whereas TSMC looks at High-NA EUV lithography as on technology for the 2030s.
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Anton Shilov is a contributing writer at Tom\u2019s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends. ","collapsible":{"enabled":true,"maxHeight":250,"readMoreText":"Read more","readLessText":"Read less"}}), "https://slice.vanilla.futurecdn.net/13-4-25/js/authorBio.js"); } else { console.error('%c FTE ','background: #9306F9; color: #ffffff','no lazy slice hydration function available'); } Anton Shilov Social Links Navigation Contributing Writer Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.
Zaranthos The struggle to meet demand seems to have shifted the priority towards volume over adopting more advanced processes, at least when it comes to volume production. This wouldn't be a good long term strategy though and I would imagine they know this and have contingencies in place to leapfrog more advanced production at some point. TSMC is aggressively building out fab capacity in tandem to target both more advanced processes and volume. The race is on. Reply
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