TSMC commits another $100 billion to Arizona for at least four more 2nm fabs — 2026 capex could hit $64 billion following another record quarterly earnings

Wei also said TSMC is planning 13 leading-edge and advanced packaging fabs in Taiwan over the next several years, heading off concerns that the U.S. buildout comes at Taiwan’s expense. Execution in Arizona still faces la…

Intel becomes the first company to ship high-volume logic chips made with ASML’s High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55

Intel and ASML have been working towards this milestone for several years. In 2024, Intel completed installation of one of the industry’s first commercial High NA EUV lithography systems , the TWINSCAN EXE:5000, at its H…